HCP-Auto Copper ESD Field Coupling Device

Condition:
New
Dimensions of Field Coupling Plane:
170 mm × 360 mm
Material:
Copper, 1 mm thick
Dimensions of Field Coupling Strip:
40 mm wide
Discharge Island:
φ 80 mm
Non-Conductive Module:
εr <2.5, 50 mm height
Weight:
1.6 kg / ~3.5 pounds
Standards Met:
ISO 10605
Applications:
Electrostatic Discharge Immunity Test
Manufacturer:
The EMC Shop

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Datasheet (PDF File)

 

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Availability:

In Stock

SKU:
5873

 

 

This product is available for shipping to North America and Western European countries.


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Overview

The EMC Shop HCP-Auto Copper ESD Field Coupling Device is designed in accordance with ISO 10605 (Annex F) and GB/T 19951. Its field coupling plane and discharge island can be used to conduct direct discharge and indirect discharge tests.

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Key Considerations

Manufacturer:
The EMC Shop
Dimensions of Field Coupling Plane:
170 mm × 360 mm
Material:
Copper, 1 mm thick
Dimensions of Field Coupling Strip:
40 mm wide
Discharge Island:
φ 80 mm
Non-Conductive Module:
εr
Weight:
1.6 kg / ~3.5 pounds
Standards Met:
ISO 10605
Applications:
Electrostatic Discharge Immunity Test